|
HI- RELIABILITY SCREENING PROGRAM
|
|
TEST DESCRIPTION
|
QUALITY ASSURANCE LEVELS
|
|
STX
|
STXV
|
STS
|
|
INTERNAL VISUAL (PRE-CAP) INSPECTION
|
|
 |
 |
|
TEMPERATURE CYCLING (Method 1051
Condition G 10 Cycles)
|
 |
|
|
|
CONSTANT ACCELERATION 1/ (Method 2006
10K G’s Y1 Axis only)
|
|
|
|
|
PARTICLE IMPACT NOISE DETECTION (PIND)
|
|
|
|
|
SERIALIZATION
|
|
|
|
|
PRE BURN-IN ELECTRICAL TEST
|
|
|
|
|
HIGH TEMPERATURE REVERSE BIAS
(BURN-IN)
Transistors = Method 1039 Condition A
FETS = Method 1042 Condition A
Diodes = Method 1038 Condition A
SCR’s = Method 1040
|
|
|
|
|
FINAL ELECTRICAL PARAMETER (DC-100%)
|
|
|
|
|
HERMETIC SEAL (FINE & GROSS LEAK) 2/
(Method 1071)
|
|
|
|
|
RADIOGRAPHY
|
|
|
|
|
GROUP A (Static parameters @ 25C)
|
|
|
|
|
GROUP B SOLDERABILITY /3 (Method 2026)
|
|
|
|
|
GROUP B RESISTANCE TO SOLVENTS
(Method 1022)
|
|
|
|
|
1/ Performed on Wire Bond Devices
|
|
2/ Performed For Cavity Devices
|
|
3/ For Case Mounted Only
|
|
|
|
|
|
