|
HI- RELIABILITY SCREENING PROGRAM
|
|
TEST DESCRIPTION
|
QUALITY ASSURANCE LEVELS
|
|
STX
|
STXV
|
STS
|
|
INTERNAL VISUAL (PRE-CAP) INSPECTION
|
|
 |
 |
|
TEMPERATURE CYCLING
|
 |
 |
 |
|
SURGE 1/
|
 |
 |
 |
|
THERMAL RESPONSE 1/
|
 |
 |
 |
|
CONSTANT ACCELERATION 2/
|
 |
 |
 |
|
PARTICLE IMPACT NOISE DETECTION (PIND)
|
|
|
 |
|
SERIALIZATION
|
|
|
 |
|
INTERIM ELECTRICAL PARAMETERS 3/
|
 |
 |
 |
|
HIGH TEMPERATURE REVERSE BIAS (HTRB)
|
 |
 |
 |
|
INTERIM ELECTRICAL & DELTA PARAMETERS
|
 |
 |
 |
|
BURN-IN
|
 |
 |
 |
|
INTERIM ELECTRICAL & DELTA PARAMETERS
|
 |
 |
 |
|
FINAL ELECTRICAL PARAMETER (DC-100% AC-LTPD)
|
 |
 |
 |
|
HERMETIC SEAL (FINE & GROSS LEAK)
|
 |
 |
 |
|
RADIOGRAPHY
|
|
|
 |
|
EXTERNAL VISUAL EXAMINATION
|
|
|
 |
|
1/ PERFORMED IF TEST CONDITIONS SPECIFIED IN SPECIFICATIONS
|
|
2/ PERFORMED ON GOLD BOND DEVICES ONLY
|
|
3/ FOR CASE MOUNTED ONLY
|